Siemens expands OSAT Alliance to boost US chip supply chains
Mosaic Microsystems will use Siemens‘ EDA technologies to develop ADKs for its thin glass substrate technology, while NHanced Semiconductors will employ Siemens EDA tech to develop ADKs for their silicon interposer-based tech.
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Samsung develops next-gen cooling tech with Johns Hopkins
By leveraging newly created thin-film Peltier semiconductor devices advanced through cutting-edge nano-engineering technology for the first time, the research team has successfully developed and demonstrated a high-performance Peltier refrigerator.
Energy Vault, Jupiter sign deal for additional 100 MW BESS
The BESS system will be built with the Energy Vault’s proprietary X-Vault integration platform using Energy Vault’s proprietary UL9540 certified B-VAULT product, and VaultOS Energy Management System to control, manage and optimize the BESS operations.
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High-Voltage Connections: The Driving Force Behind Electric Vehicles
The IEA’s latest Global EV Outlook report reveals a surge in electric car sales, projected to reach a staggering 17 million units by the end of 2024. This marks a significant milestone in the automotive industry, as EVs are expected to constitute more than one in five cars sold worldwide. As the EV market accelerates, the critical role of advanced connector technology in sustaining this growth becomes increasingly evident. Here, Dawn Rogers, senior product manager at connector specialist PEI-Genesis, explores how connectors are powering the EV development.
Northrop invests $50M in Firefly to advance medium launch vehicle
Built upon Northrop Grumman’s Antares and Firefly Aerospace’s Alpha rocket, Eclipse offers a significant leap in power, performance, production cadence and payload capacity.
GF looks to reshore chipmaking in $16B US investment
Working with the Trump administration and supported by tech companies seeking to onshore critical supply chain components, GlobalFoundries plans to invest USD 16 billion to expand its manufacturing and advanced packaging capabilities in New York and Vermont.
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Agfa, Technica announce partnership for US Orgacon distribution
Orgacon is Agfa’s advanced portfolio of conductive inks and coatings that includes coating formulations and EL-P screen inks for optical, anti-static and printed electronic applications.
Nvidia selects Navitas to collaborate on 800 V HVDC architecture
Navitas’ high-power GaNSafe power ICs integrate control, drive, sensing and critical protection features, enabling reliability and robustness.
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Factorial ships solid-state cells to Avidrone for drone deployment
Avidrone will integrate Factorial’s solid-state cells into its high-endurance cargo drone platform for demonstration flights focused on evaluating energy efficiency, power discharge, payload capacity, and range under real-world operating conditions.
Air Liquide’s gas supply deal with VSMC to boost Singapore’s chip industry
Strategically located within the Tampines Wafer Fab Park, one of Singapore’s four key wafer fabrication hubs, the new facility will bolster Singapore’s position as a global semiconductor powerhouse.
Mitsubishi partners with DEScycle to enhance metal recycling tech
DEScycle’s proprietary technology enables to selectively dissolve metals at room temperature and atmospheric pressure, and is expected recover metals with significantly lower energy consumption and environmental impact.
Repair instead of disposal – a new approach to defects in electronics manufacturing
With environmental regulations such as the EU’s Carbon Border Adjustment Mechanism (CBAM) and other CO₂-related directives approaching implementation, electronics manufacturers are under growing pressure to rethink how they manage defective components. In this context, repair and reuse are emerging as viable alternatives to replacement and scrapping.
Dutch HQ/2 project releases open-architecture quantum computer
The “open-architecture” approach to building Tuna-5 system, as opposed to the vertically integrated quantum computers available via some leading commercial players, is a distinctive feature of the Delft quantum ecosystem.
IIT Kharagpur, A*STAR team up to advance semiconductor innovation
The MoU opens new avenues for joint research in advanced CMOS and post-CMOS technologies; heterogeneous integration and packaging; AI hardware accelerators; next-generation memory systems; photonics and quantum devices; and chip reliability, thermal management and failure analysis.
Factronix: reclaimed components key to greener electronics
As the electronics industry faces growing pressure to improve sustainability and resource efficiency, Germany’s Factronix is promoting component reclaim and reuse as a viable path forward.
Materion expands its semiconductor footprint and capabilities
Materion is expanding its presence in Asia’s semiconductor market through the acquisition of a newmanufacturing facility in South Korea.
QphoX, Rigetti, NQCC to partner on readout of quantum processors
In a recent demonstration, QphoX and Rigetti validated the potential of this technique by optically reading out the state of a single superconducting qubit.
Jupiter partners with Pickkup to bolster EV adoption in India
The partnership aims to deploy 300 units of JEM TEZ, JEM’s electric light commercial vehicle, in Pickkup’s growing EV fleet by the end of this year.
Honda partners with Astroscale to boost on-orbit satellite refueling
Honda will apply its mechatronics technologies to co-develop the connecting system with an aim to integrate it with Astroscale RPOD (rendezvous, proximity operations and docking) technology.
U.S. imposes new export restrictions on chip design software to China
The United States has instructed a wide range of companies to halt shipments of various products to China without a license, and has revoked previously issued licenses for certain vendors, according to a report from Reuters.
EnSilica opens new engineering hub in Cambridge
British chipmaker EnSilica has established a new engineering centre in Cambridge, strengthening its capabilities in mmWave and RF IC design amid rising customer demand.
Horiba to set up new production base in Malaysia
The Horiba Group is set to significantly expand its operations in Malaysia with plans to establish its first manufacturing facility in the state of Kedah.
VECV partners with Statiq to boost EV adoption in India
Statiq will extend access to its expanding network of over 8,000 charging points from leading CPOs on its aggregated platform across India, making charging simpler, faster and more efficient for Eicher customers.
Swedish giants to build AI factory with Nvidia
A group of leading Swedish companies – AstraZeneca, Ericsson, Saab and SEB – together with Wallenberg Investments and Nvidia, plans to build Sweden’s largest AI supercomputer. The new system will be based on Nvidia’s latest generation of accelerated computing and operated by a jointly owned company to provide sovereign, secure access to AI compute capacity.
TSMC to launch European chip design centre in Munich
Taiwanese semiconductor giant TSMC is preparing to strengthen its European presence with the opening of a new design centre in Munich, Germany.
Mario Merino takes the helm at Avnet Abacus
Mario Merino will be appointed as president of Avnet Abacus, effective 1 July 2025. He will succeed Rudy Van Parijs, who is set to retire at the end of Avnet's 2025 fiscal year after more than three decades with the company.
Kandi partners with CBAK to launch US lithium battery facilities
Each facility will be operated as a separate joint venture between the two Chinese companies, with differing ownership structures tailored to the specific nature and scope of each project.
ST expands "Lab-in-Fab" initiative in Singapore
STMicroelectronics says that it is partnering with the A*STAR Institute of Microelectronics (A*STAR IME) and ULVAC, to expand its “Lab-in-Fab” (LiF) in Singapore. The focus of the collaboration is to advance piezoelectric MEMS for applications in personal electronics, medical devices, and other applications.
Dubai’s du announces $540M hyperscale data center deal with Microsoft
The hyperscale data center will have Microsoft as the main tenant and its capacity will be delivered in tranches.
ClassOne, IBM Research team up to develop non-NMP solvent processing
The focus of the joint project will be to develop best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices.
KLA opens $138M R&D and manufacturing facility in Wales
KLA Corporation has inaugurated a new USD 138 million R&D and manufacturing facility in Newport, Wales, expanding its footprint in the UK. It will serve as the new home for KLA's SPTS division, which specialises in advanced wafer processing technologies.
L&T-Cloudfiniti partners with QpiAI to drive quantum computing workloads
The two companies will initiate and execute joint R&D programmes focussed on next-generation solutions at the intersection of AI and quantum computing, in India.
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